OnLogic introduces four new compact, industrial and rugged fanless computing platforms
OnLogic, a global industrial computer hardware manufacturer and IoT solution provider, recently announced four new compact, industrial and rugged fanless computing platforms powered by the new Intel Atom x6000E, Celeron N and Pentium J series processors formerly known as “Elkhart Lake”.
The Helix 310, Helix 330, Karbon 410 and Karbon 430 join OnLogic’s line of highly customizable, passively cooled devices for use in Industry 4.0 applications.
“We’ve been working with Intel for over a decade to build solutions for the ever-evolving Industrial IoT landscape,” says OnLogic VP of Engineering Michael Kleiner. “Helix 300 and Karbon 400 have been engineered to take advantage of the new features built into the latest generation of Intel processors to enhance IoT functionality. From machine learning and artificial intelligence, to advanced SCADA or networking, the combination of Intel technology and the plethora of configuration possibilities we’ve built into these systems means users can tailor a platform to their exact needs. The specialized solutions our clients will build with these news platforms promise to change the way goods are made, data is acted upon, and business is done in virtually every industry.”
Highly Configurable with Options for Specialized Solutions
IoT-specific features of the Helix 300 and Karbon 400 Series include the Intel® Programmable Services Engine (Intel PSE). The Intel PSE is a dedicated offload engine for IoT workloads powered by an ARM Cortex-M7 microcontroller, which enables enhanced real-time computing. The new systems also leverage OnLogic’s ModBay expansion technology, which allows users to customize systems with additional connectivity options via available M.2 and mPCIe slots.
Like most OnLogic devices, the systems will be available to configure and purchase directly from the company’s website, or by working with their global team of Solution Specialists. Each of the four new devices will be configurable with a range of Windows or Linux operating systems and can be paired with OnLogic’s suite of OEM services, including custom branding, software imaging, custom fulfilment services, and lifecycle management support.
Helix 300 Series Details
The Helix 300 Series harnesses the enhanced power and capabilities of Intel’s latest Celeron and Pentium processors in a low profile fanless system built for the challenges of the IoT edge. With support for triple independent 4K displays, a 0°C to 50°C operating temperature range, and a wealth of configuration options, the Helix 310 and Helix 330 were engineered with versatility in mind. Features and specifications include: Dual-Core Celeron N6211 or Quad-Core Pentium J6425 CPU, 3 USB 3.2 & 3 USB 2.0 ports, 2 COM, 3 DisplayPort, 1 Gb LAN port (2 Gb LAN available with Pentium CPU), 12-24 V power input, and up to 32 GB memory. Optional features include: DIO, 2 additional COM, CAN Bus, and 3 additional antennas.
The Helix 330 model comes equipped with 2 additional Gb LAN ports standard.
Karbon 400 Series Details
The Karbon 400 Series builds on the capabilities of the Helix 300 and adds additional environmental protections. The two new rugged models, the Karbon 410 and Karbon 430 can be configured with either the Dual-Core Intel Atom X6211E or Quad-Core Atom X6425E CPU. Built-in modularity allows users to choose the connectivity and capabilities needed for their application. With an operating temperature range of -40° to 70°C, fanless cooling and variable power input, the Karbon 400 Series has been engineered to thrive in even the most challenging environments. Features and specifications include: Dual-Core Atom x6211E or Quad-Core Atom x6425E CPU, 2 USB 3.2 & 2 USB 2.0 ports, 2 LAN with optional PoE, DisplayPort, SIM Slot, optional 4G LTE, 9-48 V power input, and up to 32 GB memory. Optional features include: 2 COM, 2 additional LAN, and GPIO.
The Karbon 430 model features two additional M.2 2280 slots, which can be used to equip additional storage, wireless connectivity or I/O. The Karbon 430 also offers an additional SIM card slot, enabling multi-carrier cellular connectivity configuration.
Both the Helix 300 Series and Karbon 400 Series are expected to be available for purchase in Q2.
DCD>New York
Article Topics
IIoT | Industry 4.0 | Intel | OnLogic | ruggedized hardware
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