NXP Semiconductors launches chip for Linux edge applications; develops cooling technique for 5G
NXP Semiconductor unveiled a new application processor with the aim of simplifying the development of industrial applications for Linux. It offers key benefits like security, performance, and compatibility with Linux while specifically focusing on edge deployments.
NXP believes that most edge devices used in smart homes and electric vehicles rely heavily on the Linux operating system. By ensuring compatibility with Linux, developers can customize edge devices and create advanced applications that are more interoperable, securely connected and comply with industry standards.
“Our new i.MX 91 family will provide the foundation for thousands of new device classes, with its high performance, connectivity and EdgeLock secure enclave setting a new standard for Linux platforms across IoT and industrial applications,” says Charles Dachs, the senior vice president and general manager of Industrial and IoT Edge at NXP.
The NXP i.MX 91 application processor has an Arm Cortex-A55 processor core that includes LPDDR4 memory and supports various peripherals. It is specifically designed for applications requiring input/output interfaces, dual Gigabit Ethernet and dual USB ports, making it a good fit for smart home and edge applications.
The development platform has a built-in secure enclave called EdgeLock to enhance the security of the edge infrastructure. This feature offers tamper detection, secure boot and lifecycle management. NXP disclosed that they would provide the i.MX 91 application processor to a limited number of customers during the early access program, set to take place in the latter half of 2023.
“The i.MX 91 family enables the rapid development of platforms that may easily pivot into new markets and new applications, leveraging existing investments and streamlining product line updates,” Dachs adds.
NXP develops a cooling technique to reduce radio unit size
NXP Semiconductors has released RF amplifier modules that utilize top-side cooling technology. According to the company, this technique makes the radio units thinner and lighter, enabling the more efficient deployment of these units in 5G infrastructure. According to NXP, the solution reduces the thickness and weight by more than 20 percent while decreasing the carbon footprint associated with manufacturing and deploying 5G base stations.
NXP has introduced its initial product employing top-side cooling technology, which combines its proprietary LDMOS and GaN semiconductor technologies. This device delivers high performance and efficiency, company executives say. The radio system has 32 transmit and 32 receive channels, providing a power output of 200 watts.
NXP states that by using top-side cooling devices, the design of radio units can be modified without requiring a separate RF shield, and the thermal management aspect is separated from the RF design.
“This innovation delivers a solution for deploying more environmentally friendly base stations while also enabling the network density needed to realize the full performance benefits of 5G,” says Pierre Piel, the vice president and general manager for Radio Power at NXP.
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Article Topics
5G | ARM | EV | Linux | NXP Semiconductors | RF | smart home | wireless
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