New chips from Ceva offer better “sensing” for robotics, metaverse applications
Ceva Inc. has announced the commercial availability of the new addition to its family of sensor fusion products that will endow consumer robotics, XR glasses, and 3D audio headsets with more precise motion tracking, heading, and orientation detection. After all, one doesn’t want to get lost in the metaverse.
Ceva’s new FSP201 allows manufacturers to choose from a list of external 6-axis IMU (inertial measurement unit) sensors from a variety of suppliers to overcome supply chain issues. The high-performance and low-power sensor hub microcontroller can deliver accurate sensor fusion for motion tracking, heading, and orientation detection.
The Ceva FSP201 sensor hub combines the in-house MotionEngine sensor processing software and a 32-bit Arm microcontroller for consumer electronics. The low-power Arm Cortex-M23 microcontroller is designed for cost-sensitive and power-constrained solutions for many devices to meet the increasing demands for embedded edge applications. As the company notes, the FSP201 sensor hub is designed for smart devices that require sensor fusion technology in their applications.
“High precision motion tracking, heading, and orientation are key features of today’s consumer robots and entertainment devices and are central to emerging metaverse and IoT applications and services. FSP201 ensures developers can rapidly develop products that leverage our industry-leading sensor processing technologies with components readily available in 2022,” said Chad Lucien, VP and GM of the Sensors and Audio Business Unit at Ceva.
The FSP201 sensor hub features proprietary interactive calibration software to achieve high performance with lost-cost sensors for robotic use cases. The high-performance FSP201 sensor hub microcontroller also features a stabilized game rotation vector, dynamic calibration, power management unit, and auto-centering.
For easy integration into printed circuit boards, the 6-axis sensor provides flexibility using I2C and UART serial communication protocols. In the ongoing supply chain issues, Ceva has “secured” supply of the FSP201 MCU and IMU sensors for quicker time-to-market. The new sensor hub is also code-compatible with the BNO08X series of 9-axis sensor SiP, allowing developers to migrate to a 6-axis sensor fusion technology.
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Article Topics
AR/VR | ARM | Ceva Inc | chip | metaverse | robotics | sensor fusion
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