Cadence introduces Celsium Studio for multiphysics simulation of electronic systems
Cadence has announced the launch of Celsius Studio, a platform designed for the comprehensive simulation of electronic systems, with a specific focus on thermal, stress, and electronics cooling analysis. The company’s aim is to bridge the gap that has traditionally existed between electrical and mechanical analysis for thermal integrity, performance optimization, and design efficiency. This solution not only accelerates the design cycle but also improves reliability of the final design.
In the past, designing and analyzing electronic systems required the use of separate tools for electrical and mechanical simulations, resulting in inefficiencies and lack of coherence in the overall design process. To tackle this challenge, Celsius Studio has adopted an integrated approach, offering a unified platform that converges both Electronic Computer-Aided Design (ECAD) and Mechanical Computer-Aided Design (MCAD) systems.
“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis, but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” says Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence.
Cadence Celsius Studio extends its capabilities to include the analysis of both 2.5D and 3D-IC packages. This capability is important for next-gen semiconductor designs, where packaging technologies significantly impact overall performance and form factor. The Cadence Optimality Intelligent System Explorer within the Celsius Studio platform uses AI technology to efficiently explore the entire design space, converging on the most optimal design solution.
The comprehensive analysis studio combines Finite Element Method (FEM) and Computational Fluid Dynamics (CFD) engines to facilitate thermal integrity analysis across various components within electronic systems. This integration allows for a full-spectrum thermal performance evaluation from the chip level, through the package and board, and up to the entire system.
“Our collaboration with Cadence has significantly increased our product development by 30%, optimizing the package design process and reducing turnaround time,” says WooPoung Kim, head of Advanced Packaging, Samsung Device Solutions Research America.
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