Windbond

UMC and partners targets edge AI with W2W 3D IC project launch

Oct 31, 2023

Semiconductor foundry, United Microelectronics Corporation (UMC) has initiated its W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday,…

Windbond

UMC and partners targets edge AI with W2W 3D IC project launch

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