UMC and partners targets edge AI with W2W 3D IC project launch
Semiconductor foundry, United Microelectronics Corporation (UMC) has initiated its W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday,…
Semiconductor foundry, United Microelectronics Corporation (UMC) has initiated its W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday,…
By Harikrishna Kundariya, co-founder and director of eSparkBiz Technologies We are knocking at the door of 2024, and we know…
Syntiant Corporation, an edge AI deployment company, and GlobalSense, a developer of sound-based machine learning applications for the auto industry,…
Rugged edge and embedded computing tech provider Premio Inc. has announced its new Hailo-8 AI accelerator modules for its line…
Semiconductor memory solutions provider Winbond Electronics Corporation has unveiled a new technology for edge AI computing in mainstream use cases….
BrainChip, a neuromorphic computing device provider, has unveiled the early access release of its second-generation Akida IP solution. The company…
AI solutions provider Intelligent Hardware Korea (IHWK) is developing a neuromorphic computing platform for neurotechnology devices and field programmable neuromorphic…
Modzy, a machine learning platform, will be an event partner at the upcoming AI Hardware & Edge AI Summit on…
Edge Impulse, a machine learning development platform, has announced the integration of Nvidia TAO toolkit 5.0 and a new partnership…
The recently published 2023 Edge AI Technology Report delves into the present landscape of edge AI, showcasing its diverse applications…