Nokia’s new OT-compliant tools bridge the gap between man and machine
Nokia recently debuted MX Workmate, a suite of OT-compliant tools that aims to simplify the interaction between industrial workers and…
Larisa Redins is an editor at Edge Industry Review. Some of her notable accomplishments include contributing to MacDirectory Magazine, Risk Management Magazine, MacNewsWorld.com, LinuxInsider.com, DigitalTrends.com, SafetyDetectives.com, and CyberSecurityGuide.org. Larisa also regularly works with a variety of cutting-edge tech companies writing/editing blogs, case studies, white papers, marketing copy and related work. Find Larisa on LinkedIn.
Nokia recently debuted MX Workmate, a suite of OT-compliant tools that aims to simplify the interaction between industrial workers and…
L&T Technology Services Limited (LTTS), a provider of digital engineering and R&D services, recently announced a strategic partnership with BlackBerry…
Verizon and Vonage have signed a Memoriam of Understanding (MOU) to integrate Verizon network APIs into the Vonage platform. This…
Samsung Electronics, Vodafone and AMD have collaborated to successfully demonstrate an end-to-end call using the latest AMD processors, enabling Open…
Couchbase recently announced its entry into a material definitive agreement. Specifically, Couchbase, Inc. has secured a senior secured revolving loan…
According to SkyQuest’s global research, the global Autonomous Data Platform market is expected to reach 6.73 billion by 2030, increasing…
NXP recently introduced the MCX A14x and A15x series, all-purpose microcontrollers, as part of the MCX portfolio. These microcontrollers share…
The global association of companies supporting the LoRaWan standard for IoT LPWans reports “robust adoption” and increasing maturity in its…
Vultr has introduced Vultr CDN, a content delivery network designed for media-rich digital experiences. By leveraging its global infrastructure across…
Dresden-based company Semron has successfully raised $7.9 million in seed funding for its AI chips featuring 3D packaging designed for…